Molecular dynamics simulation of diffusion bonding of Al–Cu interface

Published 2014 View Full Article

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Title
Molecular dynamics simulation of diffusion bonding of Al–Cu interface
Authors
Keywords
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Journal
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING
Volume 22, Issue 6, Pages 065013
Publisher
IOP Publishing
Online
2014-08-06
DOI
10.1088/0965-0393/22/6/065013

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