Atomistic simulation of diffusion bonding of dissimilar materials undergoing ultrasonic welding
出版年份 2019 全文链接
标题
Atomistic simulation of diffusion bonding of dissimilar materials undergoing ultrasonic welding
作者
关键词
Molecular dynamics, Diffusion bonding, Ultrasonic welding, Dissimilar materials, Interface, EAM potential
出版物
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume -, Issue -, Pages -
出版商
Springer Nature
发表日期
2019-03-26
DOI
10.1007/s00170-019-03582-9
参考文献
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