Atomistic simulation of diffusion bonding of dissimilar materials undergoing ultrasonic welding

标题
Atomistic simulation of diffusion bonding of dissimilar materials undergoing ultrasonic welding
作者
关键词
Molecular dynamics, Diffusion bonding, Ultrasonic welding, Dissimilar materials, Interface, EAM potential
出版商
Springer Nature
发表日期
2019-03-26
DOI
10.1007/s00170-019-03582-9

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