On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150–210 °C

Published 2018 View Full Article

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Title
On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150–210 °C
Authors
Keywords
Soldering, Ni, 3, Sn, 4, phase, Growth kinetics, Interface reaction, Grain boundary diffusion
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 742, Issue -, Pages 199-211
Publisher
Elsevier BV
Online
2018-02-01
DOI
10.1016/j.jallcom.2018.01.253

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