Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs

Double-Sided Process for MEMS SOI Sensors With Deep Vertical Thru-Wafer Interconnects

(2018) Alexandra Efimovskaya et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

(2018) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

(2018) L. A. Menk et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

(2016) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging

(2013) Ju-Yong Lee et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Extreme Bottom-up Filling of Through Silicon Vias and Damascene Trenches with Gold in a Sulfite Electrolyte

(2013) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

(2013) D. Wheeler et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Leveler Effect and Oscillatory Behavior during Copper Electroplating

(2012) Q. Huang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

(2012) T. P. Moffat et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Modeling Extreme Bottom-Up Filling of Through Silicon Vias

(2012) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

MSA as a Supporting Electrolyte in Copper Electroplating for Filling of Damascene Trenches and Through Silicon Vias

(2011) Sung Ki Cho et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

3D integration review

(2011) Mukta G. Farooq et al.   Science China-Information Sciences

Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration

(2009) O. Lühn et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Bottom-up filling optimization for efficient TSV metallization

(2009) Elise Delbos et al.   MICROELECTRONIC ENGINEERING

Wafer-level bonding/stacking technology for 3D integration

(2009) Cheng-Ta Ko et al.   MICROELECTRONICS RELIABILITY