Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

(2017) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper Electroplating with Polyethylene Glycol

(2017) Hongliu Yang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints

(2017) Hsuan Lee et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives

(2016) Yan Wang et al.   ELECTROCHIMICA ACTA

Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias

(2016) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

(2016) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effects of Cu Electroplating Formulas on the Interfacial Microstructures of Sn/Cu Joints

(2016) Tai-Yi Yu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums

(2015) Myung Jun Kim et al.   ELECTROCHIMICA ACTA

Evaluating the Performance of 2-Mercapto-5-Benzimidazolesulfonic Acid in Controllable Electro-Healing Cracks in Nickel

(2015) X. G. Zheng et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Bottom-Up Electrodeposition of Zinc in Through Silicon Vias

(2015) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

The Limitation and Optimization of Bottom-Up Growth Mode in Through Silicon Via Electroplating

(2015) Liu Yang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of External Factors on Copper Filling in 3D Integrated Through-Silicon-Vias (TSVs)

(2015) Y. Zhang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections

(2015) Y.-T. Lin et al.   ECS Electrochemistry Letters

Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition

(2014) Minoru TAKEUCHI et al.   ELECTROCHEMISTRY

Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling Process

(2014) Yazhou Zhang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating

(2014) Liu Yang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Liquid flow along a solid surface reversibly alters interfacial chemistry

(2014) D. Lis et al.   SCIENCE

Dynamics of polymer adsorption from dilute solution in shear flow near a planar wall

(2013) Sarit Dutta et al.   JOURNAL OF CHEMICAL PHYSICS

Copper Deep Via Filling with Selective Accelerator Deactivation by Polyethyleneimine

(2013) Masanori Hayase et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

An Investigation on Polyethyleneimine and Saccharin on Controllable Electro-Healing Cracks in Nickel

(2013) X. G. Zheng et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Extreme Bottom-up Filling of Through Silicon Vias and Damascene Trenches with Gold in a Sulfite Electrolyte

(2013) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Through-Silicon-Via (TSV) Filling by Electrodeposition of Cu with Pulse Current at Ultra-Short Duty Cycle

(2013) Sanghyun Jin et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor

(2013) Myung Jun Kim et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

(2013) D. Wheeler et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism

(2013) Liu Yang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Inverse analysis of accelerator distribution in copper through silicon via filling

(2012) Tatsuro Matsuoka et al.   ELECTROCHIMICA ACTA

Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

(2012) F. Wafula et al.   JOURNAL OF ELECTRONIC MATERIALS

Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition

(2012) M. Takeuchi et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

(2012) T. P. Moffat et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Modeling Extreme Bottom-Up Filling of Through Silicon Vias

(2012) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Single-polymer adsorption in shear: Flattening vs. hydrodynamic lift and surface potential corrugation effects

(2010) A. Serr et al.   EPL

Monitoring the Superfilling of Blind Holes with Electrodeposited Copper

(2010) O. Lühn et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper Deep Via Filling with Selective Accelerator Deactivation by a Reverse Pulse

(2010) Masanori Hayase et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper electroplating into deep microvias for the “SiP” application

(2010) Cheng Fang et al.   MICROELECTRONIC ENGINEERING

Copper plating for 3D interconnects

(2010) A. Radisic et al.   MICROELECTRONIC ENGINEERING

Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration

(2009) O. Lühn et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Improving Copper Electrodeposition in the Microelectronics Industry

(2009) Yihua Liu et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Inhibition of Copper Deposition by Polyethylene Glycol and Chloride

(2009) M. E. Huerta Garrido et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

(2008) Y. Liu et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY

Voltammetric Study of the Inhibition Effect of Polyethylene Glycol and Chloride Ions on Copper Deposition

(2008) M. E. Huerta Garrido et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY