Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding

Mechanisms for room temperature direct wafer bonding

(2013) T. Plach et al.   JOURNAL OF APPLIED PHYSICS

Formation of gallium arsenide nanostructures in Pyrex glass

(2013) Matiar M R Howlader et al.   NANOTECHNOLOGY

MEMS Reliability Review

(2012) Yunhan Huang et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Comprehensive investigation of Ge–Si bonded interfaces using oxygen radical activation

(2011) Ki Yeol Byun et al.   JOURNAL OF APPLIED PHYSICS

Comparing Isoelectric Point and Surface Composition of Plasma Modified Native and Deposited SiO2 Films Using Contact Angle Titrations and X-ray Photoelectron Spectroscopy

(2011) Kristina J. Trevino et al.   Plasma Processes and Polymers

Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration

(2010) M. M. R. Howlader et al.   IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

Tribological properties of adsorbed water layer on silicon surfaces

(2010) Doo-In Kim et al.   International Journal of Precision Engineering and Manufacturing

Sequential Plasma-Activated Bonding Mechanism of Silicon/Silicon Wafers

(2010) Matiar M. R. Howlader et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Annealing Temperature-Dependent Interfacial Behavior of Sequentially Plasma-Activated Silicon Bonded Wafers

(2010) Matiar M. R. Howlader et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Void nucleation at a sequentially plasma-activated silicon/silicon bonded interface

(2010) M M R Howlader et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale

(2010) M G Kibria et al.   NANOTECHNOLOGY

Evidence for surface oxidation on Pyrex of NO into NO2by adsorbed O atoms

(2010) O Guaitella et al.   PLASMA SOURCES SCIENCE & TECHNOLOGY

Microfabricated Reference Electrodes and their Biosensing Applications

(2010) M. Waleed Shinwari et al.   SENSORS

Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200°C

(2010) M.M.R. Howlader et al.   TALANTA

Study of the Ge Wafer Surface Hydrophilicity after Low-Temperature Plasma Activation

(2009) Xiaobo Ma et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Role of Heating on Plasma-Activated Silicon Wafers Bonding

(2009) M. M. R. Howlader et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY