Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding
出版年份 2013 全文链接
标题
Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding
作者
关键词
-
出版物
ECS Journal of Solid State Science and Technology
Volume 2, Issue 12, Pages P515-P523
出版商
The Electrochemical Society
发表日期
2013-10-23
DOI
10.1149/2.007312jss
参考文献
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