Cu filling of TSV using various current forms for three‐dimensional packaging application

Effective Cu Filling Method to TSV for 3-dimensional Si Chip Stacking

(2016)   Korean Journal of Metals and Materials

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

(2013) S. Costello et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

High-Speed Through Silicon Via(TSV) Filling Using Diallylamine Additive

(2011) Taro Hayashi et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Green Emission of Silicon Quantum Dot Light-emitting Diodes caused by Enhanced Carrier Injection

(2011) Baek Hyun Kim et al.   JOURNAL OF THE KOREAN PHYSICAL SOCIETY

Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking

(2011) Sung Chul Hong et al.   MICROELECTRONICS RELIABILITY

A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging

(2010) Jiheon Jun et al.   MATERIALS TRANSACTIONS

Electrochemical investigations for copper electrodeposition of through-silicon via

(2010) Tzu-Hsuan Tsai et al.   MICROELECTRONIC ENGINEERING

Copper electroplating into deep microvias for the “SiP” application

(2010) Cheng Fang et al.   MICROELECTRONIC ENGINEERING

Copper plating for 3D interconnects

(2010) A. Radisic et al.   MICROELECTRONIC ENGINEERING

Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives

(2010) Lutz Hofmann et al.   MICROELECTRONIC ENGINEERING

Influence of Pulse Reverse Plating on the Properties of Ni-Fe Thin Films

(2009) D. Flynn et al.   IEEE TRANSACTIONS ON MAGNETICS

Through-Silicon Via (TSV)

(2009) Makoto Motoyoshi   PROCEEDINGS OF THE IEEE

Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs

(2008) Hirokazu Kikuchi et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

New precursors for CVD copper metallization

(2008) John A.T. Norman et al.   MICROELECTRONIC ENGINEERING