Copper electroplating into deep microvias for the “SiP” application

Published 2010 View Full Article

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Title
Copper electroplating into deep microvias for the “SiP” application
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 88, Issue 5, Pages 749-753
Publisher
Elsevier BV
Online
2010-08-03
DOI
10.1016/j.mee.2010.07.034

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