Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications

标题
Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
作者
关键词
-
出版物
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 156, Issue 9, Pages H734
出版商
The Electrochemical Society
发表日期
2009-07-25
DOI
10.1149/1.3166184

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