The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass

Mechanisms for room temperature direct wafer bonding

(2013) T. Plach et al.   JOURNAL OF APPLIED PHYSICS

Microfluidic Reference Electrode with Free-Diffusion Liquid Junction

(2013) S. Safari et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Control and manipulation of microfluidic flow via elastic deformations

(2013) Douglas P. Holmes et al.   Soft Matter

Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding

(2013) A. U. Alam et al.   ECS Journal of Solid State Science and Technology

Design of a flat field concave-grating-based micro-Raman spectrometer for environmental applications

(2012) Zhiyun Li et al.   APPLIED OPTICS

Photodetection With Gate-Controlled Lateral BJTs From Standard CMOS Technology

(2012) Fernando de Souza Campos et al.   IEEE SENSORS JOURNAL

Sidewall Adhesion and Sliding Contact Behavior of Polycrystalline Silicon Microdevices Operated in High Vacuum

(2012) Daan Hein Alsem et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Compatibility study of thin passivation layers with hydrazine for silicon-based MEMS microthruster

(2012) Pijus Kundu et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Low temperature nanointegration for emerging biomedical applications

(2011) Matiar M.R. Howlader et al.   MICROELECTRONICS RELIABILITY

Comparing Isoelectric Point and Surface Composition of Plasma Modified Native and Deposited SiO2 Films Using Contact Angle Titrations and X-ray Photoelectron Spectroscopy

(2011) Kristina J. Trevino et al.   Plasma Processes and Polymers

Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration

(2010) M. M. R. Howlader et al.   IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

Tribological properties of adsorbed water layer on silicon surfaces

(2010) Doo-In Kim et al.   International Journal of Precision Engineering and Manufacturing

Sequential Plasma-Activated Bonding Mechanism of Silicon/Silicon Wafers

(2010) Matiar M. R. Howlader et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale

(2010) M G Kibria et al.   NANOTECHNOLOGY

Microfabricated Reference Electrodes and their Biosensing Applications

(2010) M. Waleed Shinwari et al.   SENSORS

Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200°C

(2010) M.M.R. Howlader et al.   TALANTA

Study of the Ge Wafer Surface Hydrophilicity after Low-Temperature Plasma Activation

(2009) Xiaobo Ma et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Role of Heating on Plasma-Activated Silicon Wafers Bonding

(2009) M. M. R. Howlader et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of Free Radical Activation for Low Temperature Si to Si Wafer Bonding

(2009) K. Y. Byun et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of nanoscale surface topography on low temperature direct wafer bonding process with UV activation

(2009) Zirong Tang et al.   SENSORS AND ACTUATORS A-PHYSICAL