Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

Published 2009 View Full Article

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Title
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 49, Issue 9-11, Pages 1267-1272
Publisher
Elsevier BV
Online
2009-08-09
DOI
10.1016/j.microrel.2009.07.040

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