Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder
Published 2011 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder
Authors
Keywords
-
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 23, Issue 1, Pages 148-155
Publisher
Springer Nature
Online
2011-10-28
DOI
10.1007/s10854-011-0552-1
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- VOLUME EFFECT OF SHEAR FRACTURE BEHAVIOR OF Sn3.0Ag0.5Cu/Cu LEAD--FREE SOLDER JOINTS
- (2011) Yanhong TIAN et al. ACTA METALLURGICA SINICA
- Influence of the addition of indium on the mechanical creep of Sn–3.5%Ag alloy
- (2010) S.E. Negm et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Electrochemical corrosion study of Sn–3Ag–3Cu solder alloy in NaCl solution
- (2009) F. Rosalbino et al. ELECTROCHIMICA ACTA
- Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes
- (2009) Shasha Zhang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints
- (2009) Wenxing Dong et al. JOURNAL OF ELECTRONIC MATERIALS
- Effect of Ag addition on the corrosion properties of Sn-based solder alloys
- (2009) Q. V. Bui et al. MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION
- Formation of Ag3Sn plates in SnAgCu solder bumps
- (2009) Jicheng Gong et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Electrochemical composite deposition of Sn–Ag–Cu alloys
- (2009) Chunfen Han et al. Materials Science and Engineering B-Advanced Functional Solid-State Materials
- Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage
- (2009) M. Berthou et al. MICROELECTRONICS RELIABILITY
- A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
- (2009) Dominik Herkommer et al. MICROELECTRONICS RELIABILITY
- Electrochemical corrosion behaviour of Pb-free Sn–8.5Zn–0.05Al–XGa and Sn–3Ag–0.5Cu alloys in chloride containing aqueous solution
- (2008) Udit Surya Mohanty et al. CORROSION SCIENCE
- Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders
- (2008) M.A. Dudek et al. JOURNAL OF ELECTRONIC MATERIALS
- Corrosion behaviour assessment of lead-free Sn–Ag–M (M=In, Bi, Cu) solder alloys
- (2008) F. Rosalbino et al. MATERIALS CHEMISTRY AND PHYSICS
- Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions
- (2008) Ja-Young Jung et al. MICROELECTRONIC ENGINEERING
- Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution
- (2007) Dezhi Li et al. CORROSION SCIENCE
Publish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn MoreBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started