Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder
出版年份 2011 全文链接
标题
Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 23, Issue 1, Pages 148-155
出版商
Springer Nature
发表日期
2011-10-28
DOI
10.1007/s10854-011-0552-1
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- VOLUME EFFECT OF SHEAR FRACTURE BEHAVIOR OF Sn3.0Ag0.5Cu/Cu LEAD--FREE SOLDER JOINTS
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- Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes
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- Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints
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- Effect of Ag addition on the corrosion properties of Sn-based solder alloys
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- Formation of Ag3Sn plates in SnAgCu solder bumps
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- Electrochemical composite deposition of Sn–Ag–Cu alloys
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- (2009) M. Berthou et al. MICROELECTRONICS RELIABILITY
- A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
- (2009) Dominik Herkommer et al. MICROELECTRONICS RELIABILITY
- Electrochemical corrosion behaviour of Pb-free Sn–8.5Zn–0.05Al–XGa and Sn–3Ag–0.5Cu alloys in chloride containing aqueous solution
- (2008) Udit Surya Mohanty et al. CORROSION SCIENCE
- Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders
- (2008) M.A. Dudek et al. JOURNAL OF ELECTRONIC MATERIALS
- Corrosion behaviour assessment of lead-free Sn–Ag–M (M=In, Bi, Cu) solder alloys
- (2008) F. Rosalbino et al. MATERIALS CHEMISTRY AND PHYSICS
- Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions
- (2008) Ja-Young Jung et al. MICROELECTRONIC ENGINEERING
- Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution
- (2007) Dezhi Li et al. CORROSION SCIENCE
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