Article
Materials Science, Multidisciplinary
Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Li-li Gao, Meng Zhao, Yong-huan Guo
Summary: The study investigated the mechanical properties of Sn58Bi solder reinforced with B4C nanoparticles for Cu/Cu metal interconnect. The addition of 0.6 wt% B4C resulted in decreased solder alloy hardness by 13.65% and an 8.9% increase in shear strength of the joint. The presence of B4C nanoparticles improved the matrix structure of the solder and inhibited the growth of Cu6Sn5 IMC.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Article
Materials Science, Multidisciplinary
Xi Wang, Liang Zhang, Mu-lan Li, Xingxing Wang, Meng Zhao
Summary: The addition of AlN ceramic particles can enhance the wettability and mechanical properties of Sn58Bi composite solders, with the optimal improvement observed at an AlN content of 0.05 wt.%. However, excessive AlN content may lead to a decrease in these properties.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2022)
Article
Materials Science, Multidisciplinary
Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Yong-huan Guo
Summary: By adding Mg particles with different mass fractions to Sn58Bi solder, the Ni substrate was successfully connected through bonding at 250°C for 2 minutes. The experimental results showed that the appropriate addition of Mg particles can slightly decrease the melting point of the solder and significantly improve its wettability on the Ni substrate. Mg particles are also capable of refining the microstructure of the solder and reducing the thickness of the interfacial Ni3Sn4 IMC layer and the grain size. As a result, the mechanical property of the joint is significantly enhanced by 53.48%, with brittle fracture as the main characteristic and the Mg2Sn phase playing a central role in strengthening. Overall, the Sn58Bi-0.4Mg/Ni solder joint exhibits the best combination performance.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Article
Materials Science, Multidisciplinary
Li Yang, Zheng Liu, Yuhang Xu, Yangyang Li, Jiawen Zhong, Xiangyu Wang, Yaocheng Zhang
Summary: This study investigates the influence of hexagonal boron nitride (BN) nanoparticle doping on the microstructure and shear properties of Sn58Bi composite solder joints. The results demonstrate that doping BN nanoparticles refines the microstructure of the composite solder and alters the morphology of the intermetallic compound layer. The shear strength of the composite solder joints initially increases and then decreases with increasing BN content.
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
(2023)
Article
Materials Science, Multidisciplinary
Peng Liu, Weiqi Guo, Ping Wu
Summary: This study manufactured GNSs modified Sn58Bi and Cu-core Sn58Bi solder joints and investigated the microstructure evolution and growth of IMCs under current stressing. The results showed that the addition of GNSs aggravated the electromigration behavior in Sn58Bi solder joints, while it inhibited the mass transfer in Cu-core Sn58Bi solder joints.
JOURNAL OF MATERIALS SCIENCE
(2022)
Article
Materials Science, Multidisciplinary
Xuemei Li, Liping Wang, Xiangwei Li, Cheng Li, Fenglian Sun, Meng Liu, Lei Zhu, Ming Li
Summary: The height of solder joints has an impact on the element diffusion at the solid-liquid interface. It was found that during reflow welding, the element diffusion coefficient increases with solder joint height, while during thermal aging, the element diffusion coefficient decreases with solder joint height.
Article
Engineering, Electrical & Electronic
Yang Liu, Boqiao Ren, Yuxiong Xue, Min Zhou, Rongxing Cao, Penghui Chen, Xianghua Zeng
Summary: Porous metals (Ni, Cu) were added into SnBi solder joint to obtain composite solder joints, and the microstructure and shear behavior were investigated under different porosity conditions. The addition of porous metals significantly increased the shear strength of the SnBi solder joint, with the highest shear strength observed in SnBi@110P-Cu solder joint.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2021)
Article
Engineering, Electrical & Electronic
Xi Wang, Liang Zhang, Chen Chen, Xiao Lu, Wei-min Long
Summary: The growth behavior of interfacial intermetallic compounds (IMC) in Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05AlN/Cu solder joints under ultrasound-assisted soldering processes was investigated. The effects of ultrasonic soldering and AlN nanoparticles on the shear strength of the solder joints were studied. Ultrasonic vibrations can enhance the mechanical properties of the solder joint by increasing nucleation mass and producing uniform and finer grains, while AlN nanoparticles inhibit the diffusion of Cu elements and reduce the growth rate of the interface IMC, leading to increased shear properties of the solder joint.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2023)
Article
Materials Science, Multidisciplinary
Xi Huang, Liang Zhang, Chen Chen, Xiao Lu, Xi Wang
Summary: This study investigated the impact of Mg particles on the properties of Sn58Bi composite solder. The results showed that Mg particles improved the wetting ability and decreased the brittleness of the solder. Additionally, the grain size at the joint interface and the thickness of IMC were reduced with the addition of Mg particles.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Article
Physics, Applied
Nan Jiang, Liang Zhang, Kai-Kai Xu, Mu-Lan Li, Feng-Jiang Wang
Summary: In this study, the addition of SiC nanowires improved the wetting behavior and shear properties of solder joints, refined the microstructure of the solder, and increased the shear strength of the joints. This suggests that incorporating SiC nanowires may be an effective way to enhance the reliability of solder joints.
INTERNATIONAL JOURNAL OF MODERN PHYSICS B
(2021)
Article
Engineering, Electrical & Electronic
Nan Jiang, Liang Zhang, Li-li Gao, Wei-min Long, Su-juan Zhong, Lei Zhang
Summary: The study investigated the effects of graphene nanosheets (GNSs) on the interfacial reaction in Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05GNSs/Cu solder joints. It was found that GNSs can act as a barrier to suppress the diffusion of metal atoms and decrease the number and dimension of microvoids at the interface, improving the reliability of solder joints for 3D packaging.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2021)
Article
Materials Science, Multidisciplinary
Yuhang Wei, Yingxia Liu, Lei Zhang, Xiuchen Zhao
Summary: By adding Al and Zn to Sn-Bi alloy, the mechanical properties of the alloy can be significantly improved, especially when the addition reaches 2 wt%. However, when the addition reaches 3 wt%, the alloy shows the best ultimate tensile strength but reduced plasticity.
MATERIALS CHARACTERIZATION
(2021)
Article
Materials Science, Multidisciplinary
Qianqian Song, Anmin Li, Da Qi, Weiou Qin, Yitai Li, Yongzhong Zhan
Summary: This paper investigates the corrosion resistance of Sn58Bi-XCr (X = 0, 0.1, 0.2, 0.3 wt%) and analyzes the electrode reaction process of the corrosion process using electrochemical impedance spectroscopy and Tafel linear extrapolation. The results show that Sn58Bi-0.3Cr has the largest capacitive arc radius and Rp in the Nyquist plot. The Sn58Bi-0.3Cr solder exhibits the highest impedance values and phase angles, indicating the best corrosion resistance.
MATERIALS CHEMISTRY AND PHYSICS
(2023)
Article
Engineering, Manufacturing
Chen Chen, Liang Zhang, Xi Huang, Xiao Lu
Summary: The purpose of this study is to investigate the mechanism of Si3N4 nanowires in Sn-based solder and provide a theoretical foundation for the design and application of lead-free solder materials in the electronic packaging industry. The findings indicate that an appropriate content of Si3N4 nanowires can significantly improve the wettability and shear strength of the solder, but excessive amounts can have a negative impact on the joint.
SOLDERING & SURFACE MOUNT TECHNOLOGY
(2023)
Article
Engineering, Electrical & Electronic
M. Nasir Bashir, Hafiz Muhammad Saad, Muhammad Rizwan, Sedat Bingol, Iftikhar Ahmed Channa, Mustabshirha Gul, A. S. M. A. Haseeb, Sumsun Naher
Summary: The study aimed to investigate the effects of cobalt nanoparticle concentrations on the tensile properties of Sn-58Bi solder material. The results showed that the addition of Co NP significantly increased the tensile strength of the solder joints. Furthermore, ductility was improved with increasing temperature, but the ultimate tensile strength decreased with longer aging time.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Materials Science, Ceramics
Ethar Yahya Salih, Mohamed Bashir Ali Bashir, Altaf Hussain Rajpar, Irfan Anjum Badruddin
Summary: This article presents the preparation of porous silicon (PS)/copper oxide (CuO) film for visible light metal-semiconductor-metal photodetector application using electrochemical etching, pulsed laser deposition, and electrochemical deposition approaches. The fabricated PS/CuO photodetectors showed high crystallinity and dendrite-like morphology at a high post-processing temperature. Significant photocurrent and photo-responsivity values were observed, with the optimal photodetector demonstrating an estimated response/recovery time of 800 ms. This proposed device not only exhibits consistency but also provides an easy pathway for optoelectronic design.
CERAMICS INTERNATIONAL
(2022)
Article
Polymer Science
Azhar Equbal, Asif Equbal, Zahid A. Khan, Irfan Anjum Badruddin, Mohamed Bashir Ali Bashir, Hussein Alrobei
Summary: In this study, ABS P400 polymer parts were fabricated using FDM process to be used as novel electrodes for die-sinking EDM. The electrodes were metallized with aluminum-charcoal and copper electroplating to meet conductivity requirement. Real-time EDM of mild steel workpiece using the electrodes showed better machining performance compared to other types of electrodes.
Article
Materials Science, Multidisciplinary
Mohamed Bashir Ali Bashir, Ethar Yahya Salih, Mohd Faizul Mohd Sabri, Altaf Hussain Rajpar, Irfan Anjum Badruddin, Mohd Zobir Hussein, Batool Eneaze Al-Jumaili
Summary: This study presents a detailed preparation and characterization of mesoporous ZnO/ZnAl2O4 mixed metal oxide (MMO) through a two-step solution procedure using Zn/Al layered double hydroxide (LDH) as starting materials. The influence of molar ratio on the properties was comprehensively explored, leading to different morphologies and surface areas.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Ergonomics
Iqra Javed, Siti Zawiah Md Dawal, Yusoff Nukman, Ashfaq Ahmad
Summary: This study collected data from 224 sewing machine operators through observation and self-reported studies in order to identify the average work productivity loss, absenteeism and presenteeism in the garment industry. Statistical models were developed using multiple linear regression with accuracies of 69.9%, 53.7% and 84.0% for work productivity loss, absenteeism and presenteeism, respectively. These models can help garment industries improve their work productivity by taking initiatives based on the findings.
INTERNATIONAL JOURNAL OF OCCUPATIONAL SAFETY AND ERGONOMICS
(2022)
Article
Engineering, Electrical & Electronic
Ethar Yahya Salih, Mohamed Bashir Ali Bashir, Altaf Hussain Rajpar, Irfan Anjum Badruddin, Ghazaleh Bahmanrokh
Summary: In this study, NiO/Si film was prepared using co-precipitation and pulsed laser deposition techniques for UV photodetector application. The higher crystallinity and lower optical bandgap of the film resulted in better photo-responsive behavior in the fabricated devices.
MICROELECTRONIC ENGINEERING
(2022)
Article
Engineering, Electrical & Electronic
Mohamed Bashir Ali Bashir, Ethar Yahya Salih, Suhana Mohd Said, Yuzuru Miyazaki, Dhafer Abdul-Ameer Shnawah, M. Nasir Bashir, Imran Haider Sajid, Mohamed Hamid Elsheikh
Summary: In this study, filled-skutterudite materials InxLa0.25Co4Sb12 were synthesized using mechanical alloying and spark plasma sintering techniques. The presence of InSb nanoinclusions was found to significantly reduce the electrical resistivity and lattice thermal conductivity, leading to an enhancement in the dimensionless figure-of-merit (ZT).
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Engineering, Electrical & Electronic
M. Nasir Bashir, Abdul Faheem Khan, Shahid Bashir, Mohamed Bashir Ali Bashir, Muhammad Jamshaid, Iqra Javed, Imran Ali
Summary: The downsizing of electronic devices has led to an increase in current density in solder joints, causing the rapid diffusion of Cu atoms and failure in lead-free solder joints. This study investigates the use of Zn nanoparticles (NP) doped flux to examine its effects on the microstructure of SAC305 solder joints under high current. Electromigration tests were conducted on SAC305 solder and SAC305 + 2 wt% Zn NP-doped solder joints at different time intervals and the results showed that the addition of Zn NP-doped flux reduced the size of interfacial intermetallic compound (IMC) in the solder joint and suppressed cracks and damages after the electromigration test.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2023)
Article
Green & Sustainable Science & Technology
Muhammad Amir Raza, Muhammad Mohsin Aman, Altaf Hussain Rajpar, Mohamed Bashir Ali Bashir, Touqeer Ahmed Jumani
Summary: The study evaluates the feasibility of developing a 100% renewable energy system in Pakistan for sustainable climate change, and finds that it can be achieved through the implementation of a green energy policy scenario. The approach is applicable to many other countries worldwide.
Article
Chemistry, Multidisciplinary
Mohamed Bashir Ali Bashir, Altaf Hussain Rajpar, Ethar Yahya Salih, Emad M. Ahmed
Summary: In this study, dye-sensitized solar cells (DSSCs) based on mesoporous CuO@Zn(Al)O-mixed metal oxides (MMO) were fabricated at different post-processing temperatures. The CuO@Zn(Al)O structure was obtained by using Zn/Al-layered double hydroxide (LDH) as a precursor. The dye loading amount onto the deposited materials was analyzed using a regression equation-based UV-Vis technique, showing a strong correlation with the power conversion efficiency of the DSSCs. Among the assembled DSSCs, CuO@MMO-550 exhibited significant fill factor and power conversion efficiency due to its high surface area and considerable dye loading amount.
Article
Engineering, Electrical & Electronic
Mohamed Bashir Ali Bashir, Ethar Yahya Salih, Altaf Hussain Rajpar, Ghazaleh Bahmanrokh, Mohd Faizul Mohd Sabri
Summary: In this study, cadmium oxide was successfully deposited on porous silicon using pulsed laser deposition. The prepared film showed specific microstructural and optical characteristics, which were closely related to its photoresponsive behavior. The fabricated devices exhibited positive linear correlation between their photoresponsive characteristics and the applied laser energy.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
(2022)
Article
Multidisciplinary Sciences
Mohamed Bashir Ali Bashir, Imran Ali, Altaf Hussain Rajpar
Summary: The development of micro-wind power technology is still in its early stages, but there is a growing market demand. The performance parameters of the proposed lantern-type five-bladed micro-vertical axis wind turbine have been optimized, and the use of a novel omnidirectional wind deflector can effectively improve the turbine's performance.
ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING
(2022)
Review
Multidisciplinary Sciences
Mohamed Bashir Ali Bashir
Summary: The share of wind-based electricity generation is increasing in the world energy market, reducing dependency on fossil fuels and decreasing global warming. The paper discusses basic principle parameters affecting wind turbine performance, as well as materials and categories of wind turbines used in manufacturing.
ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING
(2022)
Article
Robotics
A. H. Rajpar, Ahmad E. Eladwi, Imran Ali, Mohamed Bashir Ali Bashir
Summary: This paper presents the design and development of a reconfigurable three-degree-of-freedom articulated robot, along with conveniently composed mathematical models to position its arms. Through a manual control application, users can reconfigure the robot and move its arms to carry out pick-and-place tasks.
JOURNAL OF ROBOTICS
(2021)
