Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing
出版年份 2022 全文链接
标题
Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing
作者
关键词
Silicon, MD, Secondary scratching, Subsurface damage
出版物
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 144, Issue -, Pages 106624
出版商
Elsevier BV
发表日期
2022-03-08
DOI
10.1016/j.mssp.2022.106624
参考文献
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