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期刊名
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
MAT SCI SEMICON PROC
ISSN / eISSN
1369-8001
目标和范围
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
研究方向
工程：电子与电气
材料科学：综合
物理：应用
CiteScore
7.00
查看趋势图
CiteScore 学科排名
| 类别 | 分区 | 排名 |
|---|---|---|
| Engineering - Mechanical Engineering | Q1 | #94/631 |
| Engineering - Condensed Matter Physics | Q1 | #68/423 |
| Engineering - Mechanics of Materials | Q1 | #66/391 |
| Engineering - General Materials Science | Q1 | #105/453 |
Web of Science 核心合集
| Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
|---|---|
| Indexed | - |
| 类别 (Journal Citation Reports 2023) | 分区 |
|---|---|
| ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE | Q2 |
| MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE | Q2 |
| PHYSICS, APPLIED - SCIE | Q2 |
| PHYSICS, CONDENSED MATTER - SCIE | Q2 |
H-index
49
出版国家或地区
ENGLAND
出版商
Elsevier Ltd
出版周期
Bimonthly
年文章数
706
Open Access
NO
通讯方式
ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
认证评论
4.18 with editor
4.19 with editor
4.28 under review Review invitations sent: 4
4.29 under review Review invitations accepted: 1
5.5 reviewed completed: 1
5.8 invitations sent: 4+3
5.9 invitations accepted: 2
5.18 reviewed completed: 2
5.20 revise (reviewed completed: 3) Due on June 10
6.3 revise submission
6.6 required review completed (2)
6.6 under review
6.11 Required Reviews Complete 3
3.12 Accepted
Translation:
4.15 JAC transfer submitted
4.18 with editor
4.19 with editor
4.28 under review Review invitations sent: 4
4.29 under review Review invitations accepted: 1
5.5 reviewed completed: 1
5.8 invitations sent: 4+3
5.9 invitations accepted: 2
5.18 reviewed completed: 2
5.20 revise (reviewed completed: 3) Due on June 10
6.3 revise submission
6.6 required review completed (2)
6.6 under review
6.11 Required Reviews Complete 3
3.12 Accepted
2023.04.17 Received reviewer comments, all three reviewers suggest major revisions
2023.05.28 Submitted revised version
2023.06.14 Received reviewer comments, two reviewers suggest minor revisions, while one suggests acceptance
2023.06.26 Submitted revised version
2023.06.27 Accepted
Overall, the reviewing process and editorial handling were very fast, and the reviewers were also very professional, greatly helping to improve the overall quality of the article.
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