Surface effect induced Cu-Cu bonding by Cu nanosolder paste

标题
Surface effect induced Cu-Cu bonding by Cu nanosolder paste
作者
关键词
Cu-Cu bonding, Nanoparticles, Nanosolder paste, Surface effect, Sintering
出版物
MATERIALS LETTERS
Volume 184, Issue -, Pages 193-196
出版商
Elsevier BV
发表日期
2016-08-23
DOI
10.1016/j.matlet.2016.08.085

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started