Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

(2013) Yunhui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Low-Temperature Bonding of Silver to Aluminum

(2013) Yusuke Yasuda et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

(2013) Yunhui Mei et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Low-Temperature Pressure-Less Silver Direct Bonding

(2013) Teppei Kunimune et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films

(2013) Vanessa Smet et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

An innovative method for joining materials at low temperature using silver (nano)particles derived from [AgO2C(CH2OCH2)3H]

(2012) Annerose Oestreicher et al.   APPLIED SURFACE SCIENCE

Silver nanoparticles: a brief review of cytotoxicity and genotoxicity of chemically and biogenically synthesized nanoparticles

(2012) Renata de Lima et al.   JOURNAL OF APPLIED TOXICOLOGY

Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste

(2012) Tao Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

(2012) Peng Peng et al.   JOURNAL OF MATERIALS CHEMISTRY

Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles

(2012) Shuai Wang et al.   MATERIALS LETTERS

When enough is enough

(2012) Steffen Foss Hansen et al.   Nature Nanotechnology

Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

(2012) Jianfeng Yan et al.   SCRIPTA MATERIALIA

High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles

(2012) Teppei Kunimune et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment

(2012) Masafumi Kuramoto et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Sintering of Copper Particles for Die Attach

(2012) Julian Kahler et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Mechanical properties of nano-silver joints as die attach materials

(2011) Kim S. Siow   JOURNAL OF ALLOYS AND COMPOUNDS

Low-Temperature Solid-State Silver Bonding of Silicon Chips to Alumina Substrates

(2011) Chu-Hsuan Sha et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives

(2011) Nicolas Heuck et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages

(2011) M Kuramoto et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Die Attach Materials for High Temperature Applications: A Review

(2011) V R Manikam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Solid State Bonding of Silicon Chips to Silver Buffer on Copper Substrates

(2011) Chu-Hsuan Sha et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Pick-and-Place Silver Sintering Die Attach of Small-Area Chips

(2011) Julian Kahler et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles

(2010) Masafumi Kuramot et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 $^{\circ}\hbox{C}$ and 400 $^{ \circ}\hbox{C}$ in Dry Air

(2010) Yunhui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

(2010) Hiroshi Ogura et al.   JOURNAL OF ELECTRONIC MATERIALS

State of the art of high temperature power electronics

(2010) Cyril Buttay et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature

(2009) P.J. Wang et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

High-temperature lead-free solders: Properties and possibilities

(2009) Katsuaki Suganuma et al.   JOM

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

(2009) Dun-ji Yu et al.   MATERIALS & DESIGN

Reliability challenges of automotive power electronics

(2009) U. Scheuermann   MICROELECTRONICS RELIABILITY

Adhesion mechanisms of nanoparticle silver to substrate materials: identification

(2009) Sungchul Joo et al.   NANOTECHNOLOGY

Nano-silver – a review of available data and knowledge gaps in human and environmental risk assessment

(2009) Susan W.P. Wijnhoven et al.   Nanotoxicology

Silver nanosintering: a lead-free alternative to soldering

(2008) Minoru Maruyama et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Study of Bonding Technology Using Silver Nanoparticles

(2008) Toshiaki Morita et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

(2008) Yusuke Akada et al.   MATERIALS TRANSACTIONS