Microstructural stability of Ag sinter joining in thermal cycling

Silver Nanoparticle Paste for Low-Temperature Bonding of Copper

(2011) Hani Alarifi et al.   JOURNAL OF ELECTRONIC MATERIALS

Low-temperature low-pressure die attach with hybrid silver particle paste

(2011) K. Suganuma et al.   MICROELECTRONICS RELIABILITY

SiC Die Attach Metallurgy and Processes for Applications up to 500 $^{\circ}{\rm C}$

(2011) Ping Hagler et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

(2010) Hui Shun Chin et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

High-temperature lead-free solders: Properties and possibilities

(2009) Katsuaki Suganuma et al.   JOM

Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

(2009) Seongjun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Die-attachment solutions for SiC power devices

(2009) R. Kisiel et al.   MICROELECTRONICS RELIABILITY

Study of Bonding Technology Using Silver Nanoparticles

(2008) Toshiaki Morita et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles

(2008) Toshiaki Morita et al.   MATERIALS TRANSACTIONS