A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding

Syntheses of Au–Cu-rich AuAg(AgCl)Cu alloy and Ag–Cu-rich AuAgCu@Cu core–shell and AuAgCu alloy nanoparticles using a polyol method

(2012) Masaharu Tsuji et al.   CRYSTENGCOMM

Temperature Cycling Reliability of High-Temperature Lead-Free Die-Attach Technologies

(2011) Pedro O. Quintero et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution

(2011) Y. Kobayashi et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Mechanical properties of nano-silver joints as die attach materials

(2011) Kim S. Siow   JOURNAL OF ALLOYS AND COMPOUNDS

Preparation of PVP coated Cu NPs and the application for low-temperature bonding

(2011) Yan Jianfeng et al.   JOURNAL OF MATERIALS CHEMISTRY

Stable Aqueous Based Cu Nanoparticle Ink for Printing Well-Defined Highly Conductive Features on a Plastic Substrate

(2011) Sunho Jeong et al.   LANGMUIR

Low-temperature low-pressure die attach with hybrid silver particle paste

(2011) K. Suganuma et al.   MICROELECTRONICS RELIABILITY

One-pot Preparation of Antioxidized Copper Fine Particles with a Unique Structure by Chemical Reduction at Room Temperature

(2010) Tetsu Yonezawa et al.   CHEMISTRY LETTERS

Synthesis of Ag@Cu Core–Shell Nanoparticles in High Yield Using a Polyol Method

(2010) Masaharu Tsuji et al.   CHEMISTRY LETTERS

Syntheses of Ag/Cu alloy and Ag/Cu alloy core Cu shell nanoparticles using a polyol method

(2010) Masaharu Tsuji et al.   CRYSTENGCOMM

Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

(2010) Hiroshi Ogura et al.   JOURNAL OF ELECTRONIC MATERIALS

A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

(2010) Y. Morisada et al.   JOURNAL OF ELECTRONIC MATERIALS

A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

(2010) Hui Shun Chin et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties

(2010) Y. Kobayashi et al.   SOLID STATE SCIENCES

Synthesis of Bicompartmental Ag/Cu Nanoparticles Using a Two-step Polyol Process

(2009) Masaharu Tsuji et al.   CHEMISTRY LETTERS

Preparation of Cu@Ag Core–Shell Nanoparticles Using a Two-step Polyol Process under Bubbling of N2Gas

(2009) Masaharu Tsuji et al.   CHEMISTRY LETTERS

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

(2009) T.G. Lei et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Photochemical synthesis of submicron- and nano-scale Cu2O particles

(2009) Jinlin Long et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE

Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

(2009) Seongjun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Simple new synthesis of copper nanoparticles in water/acetonitrile mixed solvent and their characterization

(2009) Md. Abdulla-Al-Mamun et al.   MATERIALS LETTERS

Controlled synthesis of copper nano/microstructures using ascorbic acid in aqueous CTAB solution

(2009) Mustafa Biçer et al.   POWDER TECHNOLOGY

Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing

(2008) Sunho Jeong et al.   ADVANCED FUNCTIONAL MATERIALS

Study of Bonding Technology Using Silver Nanoparticles

(2008) Toshiaki Morita et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

(2008) Seongjun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Size-Controlled Oxidation-Resistant Copper Fine Particles Covered by Biopolymer Nanoskin

(2008) Masanori Tomonari et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

The preparation of copper fine particle paste and its application as the inner electrode material of a multilayered ceramic capacitor

(2008) Tetsu Yonezawa et al.   NANOTECHNOLOGY

Silica-coating of metallic copper nanoparticles in aqueous solution

(2007) Y. Kobayashi et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Influence of ligand structure on the stability and oxidation of copper nanoparticles

(2007) Petri Kanninen et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE