Tribological behavior of 6H–SiC wafers in different chemical mechanical polishing slurries

The influence of concentration of hydroxyl radical on the chemical mechanical polishing of SiC wafer based on the Fenton reaction

(2018) Jiabin Lu et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Chemical Mechanical Polishing of Molybdenum in Potassium Iodate-Based Acidic Slurries

(2018) Peng He et al.   ECS Journal of Solid State Science and Technology

Material removal process of single-crystal SiC in chemical-magnetorheological compound finishing

(2017) Huazhuo Liang et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Performance of colloidal silica and ceria based slurries on CMP of Si-face 6H-SiC substrates

(2015) Guomei Chen et al.   APPLIED SURFACE SCIENCE

Material science and device physics in SiC technology for high-voltage power devices

(2015) Tsunenobu Kimoto   JAPANESE JOURNAL OF APPLIED PHYSICS

Chemical effects on the tribological behavior during copper chemical mechanical planarization

(2015) Jing Li et al.   MATERIALS CHEMISTRY AND PHYSICS

First-principles investigations for oxidation reaction processes at 4H-SiC/SiO 2 interface and its orientation dependence

(2015) Toru Akiyama et al.   SURFACE SCIENCE

Role of ionic strength in chemical mechanical polishing of silicon carbide using silica slurries

(2014) Uma Rames Krishna Lagudu et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

(2014) Yan Zhou et al.   SURFACE & COATINGS TECHNOLOGY

Extended study of the atomic step-terrace structure on hexagonal SiC (0001) by chemical-mechanical planarization

(2013) Xiaolei Shi et al.   APPLIED SURFACE SCIENCE

Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

(2013) Guoshun Pan et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical–Mechanical Polishing

(2013) Tae-Young Kwon et al.   TRIBOLOGY TRANSACTIONS

Chemical mechanical polishing: Theory and experiment

(2013) Dewen Zhao et al.   Friction

Abrasive rolling effects on material removal and surface finish in chemical mechanical polishing analyzed by molecular dynamics simulation

(2011) Lina Si et al.   JOURNAL OF APPLIED PHYSICS

Planarization of C-face 4H-SiC substrate using Fe particles and hydrogen peroxide solution

(2011) Akihisa Kubota et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY