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Step height removal mechanism of chemical mechanical planarization (CMP) for sub-nano-surface finish

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Inhibitors for organic phosphonic acid system abrasive free polishing of Cu

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Extrusion formation mechanism on silicon surface under the silica cluster impact studied by molecular dynamics simulation

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Energy transfer under impact load studied by molecular dynamics simulation

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Effects of Polishing Pressure on Electrochemical Characteristics of Silicon Wafers during CMP

(2008) Xiaolan Song et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

A study of the estimation method of the cutting force for a conical tool under nanoscale depth of cut by molecular dynamics

(2008) Zone-Ching Lin et al.   NANOTECHNOLOGY

Damage-free polishing of monocrystalline silicon wafers without chemical additives

(2008) A.Q. Biddut et al.   SCRIPTA MATERIALIA

A chemical mechanical polishing model based on the viscous flow of the amorphous layer

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