标题
Chemical mechanical polishing: Theory and experiment
作者
关键词
chemical mechanical polishing (CMP), CMP model, planarization mechanism, wafer-pad interaction, uniformity
出版物
Friction
Volume 1, Issue 4, Pages 306-326
出版商
Springer Nature
发表日期
2013-12-11
DOI
10.1007/s40544-013-0035-x
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories
- (2013) Dewen Zhao et al. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
- Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
- (2013) Dewen Zhao et al. MICROELECTRONIC ENGINEERING
- Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process
- (2013) TongQing Wang et al. Science China-Technological Sciences
- Achievement of a near-perfect smooth silicon surface
- (2013) Jing Li et al. Science China-Technological Sciences
- Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing
- (2013) Dewen Zhao et al. TRIBOLOGY INTERNATIONAL
- Role of Tribochemistry in Nanowear of Single-Crystalline Silicon
- (2012) Jiaxin Yu et al. ACS Applied Materials & Interfaces
- Planarization process of single crystalline silicon asperity under abrasive rolling effect studied by molecular dynamics simulation
- (2012) Lina Si et al. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
- Material removal mechanism during porous silica cluster impact on crystal silicon substrate studied by molecular dynamics simulation
- (2012) Ruling Chen et al. APPLIED SURFACE SCIENCE
- Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing
- (2012) Dewen Zhao et al. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
- Effects of the Polishing Variables on the Wafer-Pad Interfacial Fluid Pressure in Chemical Mechanical Polishing of 12-Inch Wafer
- (2012) Dewen Zhao et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Material Removal Mechanism of Copper CMP from a Chemical–Mechanical Synergy Perspective
- (2012) Jing Li et al. TRIBOLOGY LETTERS
- Comparison of surface damage under the dry and wet impact: Molecular dynamics simulation
- (2011) Ruling Chen et al. APPLIED SURFACE SCIENCE
- Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress uniformity in chemical mechanical planarization
- (2011) Ian Hu et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- In Situ Measurement of Fluid Pressure at the Wafer-Pad Interface during Chemical Mechanical Polishing of 12-inch Wafer
- (2011) Dewen Zhao et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Relationships between Contact Image Analysis Results for Pad Surface Texture and Removal Rate in CMP
- (2011) Michio Uneda et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Numerical and experimental investigation on multi-zone chemical mechanical planarization
- (2011) Tongqing Wang et al. MICROELECTRONIC ENGINEERING
- Effects of Chemical Additives of CMP Slurry on Surface Mechanical Characteristics and Material Removal of Copper
- (2011) Chenglong Liao et al. TRIBOLOGY LETTERS
- Modeling the Chemical-Mechanical Synergy during Copper CMP
- (2010) Jing Li et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method
- (2009) Xuesong Han et al. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
- Impact of Pad–Wafer Contact Area in Chemical Mechanical Polishing
- (2009) Suresh B. Yeruva et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- In Situ Investigation of Slurry Flow Fields during CMP
- (2009) N. Mueller et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- A Material Removal Model for CMP Based on the Contact Mechanics of Pad, Abrasives, and Wafer
- (2009) Dinçer Bozkaya et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Simulations of a stress and contact model in a chemical mechanical polishing process
- (2009) Yeou-Yih Lin et al. THIN SOLID FILMS
- Study on the Mechanical Properties of CMP Pads
- (2008) Bum Soo Kim et al. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
- Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of selected process parameters
- (2008) K.-S. Chen et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Pad Characterization and Experimental Analysis of Pad Wear Effect on Material Removal Uniformity in Chemical Mechanical Polishing
- (2008) Kihyun Park et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Design and Evaluation of Pad Grooves for Copper CMP
- (2008) D. Rosales-Yeomans et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Influence of slurry components on uniformity in copper chemical mechanical planarization
- (2008) Hyunseop Lee et al. MICROELECTRONIC ENGINEERING
- Modeling of chemical–mechanical polishing considering thermal coupling effects
- (2008) Seunghee Oh et al. MICROELECTRONIC ENGINEERING
- CMP Fill Synthesis: A Survey of Recent Studies
- (2007) A.B. Kahng et al. IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
- Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarisation
- (2007) C.L. Wang et al. INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY
Add your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload NowBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started