Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves
出版年份 2019 全文链接
标题
Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves
作者
关键词
Ultrasonic vibration cutting (UVC), Single crystal, Silicon, Micro groove, Chip, Tool vibration mark
出版物
Advances in Manufacturing
Volume -, Issue -, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2019-07-05
DOI
10.1007/s40436-019-00263-4
参考文献
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