Study of an on-line precision microgroove generating process on silicon wafer using a developed ultra-thin diamond wheel-tool

出版年份 2011 全文链接

标题

作者

关键词

出版物

Volume 20, Issue 3, Pages 339-342

出版商

Elsevier BV

发表日期

2011-01-19

DOI

10.1016/j.diamond.2011.01.033

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