A model to predict the critical undeformed chip thickness in vibration-assisted machining of brittle materials

出版年份 2013 全文链接

标题

作者

关键词

出版物

Volume 69, Issue -, Pages 57-66

出版商

Elsevier BV

发表日期

2013-03-26

DOI

10.1016/j.ijmachtools.2013.03.006

Discuss science. Find collaborators. Network.

Join a conversation

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started