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期刊名
MICROELECTRONICS RELIABILITY
MICROELECTRON RELIAB
ISSN / eISSN
0026-2714
目标和范围
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
研究方向
工程：电子与电气
纳米科技
物理：应用
CiteScore
2.80
查看趋势图
CiteScore 学科排名
| 类别 | 分区 | 排名 |
|---|---|---|
| Engineering - Safety, Risk, Reliability and Quality | Q2 | #84/192 |
| Engineering - Electrical and Electronic Engineering | Q3 | #406/738 |
| Engineering - Condensed Matter Physics | Q3 | #248/423 |
| Engineering - Surfaces, Coatings and Films | Q3 | #78/131 |
| Engineering - Atomic and Molecular Physics, and Optics | Q3 | #126/211 |
| Engineering - Electronic, Optical and Magnetic Materials | Q3 | #168/271 |
Web of Science 核心合集
| Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
|---|---|
| Indexed | - |
| 类别 (Journal Citation Reports 2023) | 分区 |
|---|---|
| ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE | Q4 |
| NANOSCIENCE & NANOTECHNOLOGY - SCIE | Q4 |
| PHYSICS, APPLIED - SCIE | Q4 |
H-index
80
出版国家或地区
ENGLAND
出版商
Elsevier Ltd
出版周期
Monthly
出版年份
1964
年文章数
329
Open Access
NO
通讯方式
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB
认证评论
2021.08.01 with editor
2021.08.02 under review
2021.08.08 under review
2021.08.11 under review
2021.08.28 decision in process
2021.08.30 revise
2021.09.29 resubmitted
2021.09.29 with editor
2021.10.01 under review
2021.10.16 under review
2021.10.29 under review
2021.11.23 decision in process
2021.11.25 minor
2021.12.23 resubmitted
2021.12.24 with editor
2022.01.04 under review
2022.01.06 Required Reviews Completed
2022.01.08 Decision in Process
2022.01.11 Accept
Translation:
2021.07.27 submitted to journal
2021.08.01 with editor
2021.08.02 under review
2021.08.08 under review
2021.08.11 under review
2021.08.28 decision in process
2021.08.30 revise
2021.09.29 resubmitted
2021.09.29 with editor
2021.10.01 under review
2021.10.16 under review
2021.10.29 under review
2021.11.23 decision in process
2021.11.25 minor
2021.12.23 resubmitted
2021.12.24 with editor
2022.01.04 under review
2022.01.06 Required Reviews Completed
2022.01.08 Decision in Process
2022.01.11 Accept
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