Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

Published 2011 View Full Article

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Title
Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish
Authors
Keywords
-
Journal
MATERIALS LETTERS
Volume 65, Issue 21-22, Pages 3216-3218
Publisher
Elsevier BV
Online
2011-07-22
DOI
10.1016/j.matlet.2011.07.015

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