Nucleation and Growth of Tin in Pb-Free Solder Joints

Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates

(2015) S.A. Belyakov et al.   MATERIALS LETTERS

Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4

(2014) S.A. Belyakov et al.   ACTA MATERIALIA

The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities

(2014) Gregory Parks et al.   JOM

Role of Fe impurities in the nucleation of metastable NiSn4

(2013) S.A. Belyakov et al.   INTERMETALLICS

Nucleation rates of Sn in undercooled Sn-Ag-Cu flip-chip solder joints

(2013) B. Arfaei et al.   JOURNAL OF APPLIED PHYSICS

The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects

(2013) Chris Kinney et al.   JOURNAL OF ELECTRONIC MATERIALS

NiSn4 formation during the solidification of Sn–Ni alloys

(2012) S.A. Belyakov et al.   INTERMETALLICS

Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints

(2012) P. Darbandi et al.   JOURNAL OF ELECTRONIC MATERIALS

In situ investigation of unidirectional solidification in Sn–0.7Cu and Sn–0.7Cu–0.06Ni

(2011) C.M. Gourlay et al.   ACTA MATERIALIA

Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

(2011) B. Arfaei et al.   JOURNAL OF ELECTRONIC MATERIALS

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

(2010) John W. Elmer et al.   JOURNAL OF ELECTRONIC MATERIALS

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

(2010) H. Tsukamoto et al.   MICROELECTRONICS RELIABILITY

Size and Substrate Effects upon Undercooling of Pb-Free Solders

(2009) Yu-chih Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

(2009) Iver E. Anderson et al.   JOURNAL OF ELECTRONIC MATERIALS

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

(2009) Sun-Kyoung Seo et al.   JOURNAL OF ELECTRONIC MATERIALS

Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys

(2009) C. M. Gourlay et al.   JOURNAL OF ELECTRONIC MATERIALS

Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

(2009) Shihua Yang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Crystallization Controlled by the Geometry of a Surface

(2009) Amanda J. Page et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

(2008) Minhua Lu et al.   APPLIED PHYSICS LETTERS

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations

(2008) V. Vuorinen et al.   JOURNAL OF ELECTRONIC MATERIALS

Undercooling and microhardness of Pb-free solders on various under bump metallurgies

(2008) Moon Gi Cho et al.   JOURNAL OF MATERIALS RESEARCH

Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

(2008) Kazuhiro Nogita et al.   SCRIPTA MATERIALIA