Ultrathin Body InGaAs-on-Insulator Metal–Oxide–Semiconductor Field-Effect Transistors with InP Passivation Layers on Si Substrates Fabricated by Direct Wafer Bonding

Title
Ultrathin Body InGaAs-on-Insulator Metal–Oxide–Semiconductor Field-Effect Transistors with InP Passivation Layers on Si Substrates Fabricated by Direct Wafer Bonding
Authors
Keywords
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Journal
Applied Physics Express
Volume 4, Issue 5, Pages 054202
Publisher
IOP Publishing
Online
2011-04-14
DOI
10.1143/apex.4.054202

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