Thermal resistance of CNTs-based thermal interface material for high power solid state device packages

Title
Thermal resistance of CNTs-based thermal interface material for high power solid state device packages
Authors
Keywords
Thermal Resistance, Plasma Enhance Chemical Vapor Deposition, Thermal Contact Resistance, Device Under Test, Thermal Interface Resistance
Journal
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 114, Issue 4, Pages 1145-1152
Publisher
Springer Nature
Online
2013-04-11
DOI
10.1007/s00339-013-7676-5

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