Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

Published 2009 View Full Article

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Title
Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method
Authors
Keywords
-
Journal
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 95, Issue 3, Pages 899-905
Publisher
Springer Nature
Online
2009-01-29
DOI
10.1007/s00339-009-5097-2

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