Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 95, Issue 3, Pages 899-905

出版商

Springer Nature

发表日期

2009-01-29

DOI

10.1007/s00339-009-5097-2

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started