A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics
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Title
A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics
Authors
Keywords
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Journal
Journal of Materials Chemistry C
Volume 6, Issue 24, Pages 6406-6415
Publisher
Royal Society of Chemistry (RSC)
Online
2018-05-23
DOI
10.1039/c8tc01849a
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