Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

Published 2018 View Full Article

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Title
Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles
Authors
Keywords
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Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 8, Issue 2, Pages 186-194
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2017-12-28
DOI
10.1109/tcpmt.2017.2780626

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