Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

出版年份 2018 全文链接

标题

作者

关键词

出版物

Volume 8, Issue 2, Pages 186-194

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2017-12-28

DOI

10.1109/tcpmt.2017.2780626

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