An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Detection of micro solder balls using active thermography and probabilistic neural network

(2017) Zhenzhi He et al.   INFRARED PHYSICS & TECHNOLOGY

Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF

(2017) Lei Su et al.   MECHANICAL SYSTEMS AND SIGNAL PROCESSING

Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography

(2017) Xiuyun Zhou et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Subsurface imaging of grain microstructure using picosecond ultrasonics

(2016) M. Khafizov et al.   ACTA MATERIALIA

Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm

(2016) Mengying Fan et al.   MICROELECTRONICS RELIABILITY

Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages

(2016) Chean Shen Lee et al.   NDT & E INTERNATIONAL

Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging

(2016) Yichun Zhang et al.   SENSORS

Reconstruction of baseline time-trace under changing environmental and operational conditions

(2016) P Aryan et al.   Smart Materials and Structures

A baseline-free and non-contact method for detection and imaging of structural damage using 3D laser vibrometry

(2016) P. Aryan et al.   Structural Control & Health Monitoring

A model-based method for damage detection with guided waves

(2016) Pouria Aryan et al.   Structural Control & Health Monitoring

Using active thermography and modified SVM for intelligent diagnosis of solder bumps

(2015) Wei Wei et al.   INFRARED PHYSICS & TECHNOLOGY

Visualization of non-propagating Lamb wave modes for fatigue crack evaluation

(2015) Yun-Kyu An et al.   JOURNAL OF APPLIED PHYSICS

A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages

(2015) Yan Li et al.   JOURNAL OF ELECTRONIC MATERIALS

Genetic algorithms for defect detection of flip chips

(2015) Lei Su et al.   MICROELECTRONICS RELIABILITY

Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

(2015) Xiuyun Zhou et al.   SENSORS

Fundamentals of picosecond laser ultrasonics

(2015) Osamu Matsuda et al.   ULTRASONICS

Defects inspection of the solder bumps using self reference technology in active thermography

(2014) Xiangning Lu et al.   INFRARED PHYSICS & TECHNOLOGY

Using active thermography for defects inspection of flip chip

(2014) Zhensong Xu et al.   MICROELECTRONICS RELIABILITY

Femtosecond imaging of nonlinear acoustics in gold

(2014) Thomas Pezeril et al.   OPTICS EXPRESS

Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling

(2013) Ming-Yi Tsai et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer

(2013) Lei Su et al.   SENSORS

Reference-free delamination detection using Lamb waves

(2013) Chul Min Yeum et al.   Structural Control & Health Monitoring

Characterization of impact damage in composite laminates using guided wavefield imaging and local wavenumber domain analysis

(2013) Matthew D. Rogge et al.   ULTRASONICS

Using BP network for ultrasonic inspection of flip chip solder joints

(2012) Lei Su et al.   MECHANICAL SYSTEMS AND SIGNAL PROCESSING

Generation and control of ultrashort-wavelength two-dimensional surface acoustic waves at nanoscale interfaces

(2012) Qing Li et al.   PHYSICAL REVIEW B

Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique

(2012) Jie Gong et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Thermal conduction analysis and characterization of solder bumps in flip chip package

(2011) Xiangning Lu et al.   APPLIED THERMAL ENGINEERING

The Application of Two-Dimensional X-ray Hot Stage in Flip Chip Package Failure Analysis

(2011) Yan Li et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Three-dimensional acoustic wavefront imaging in anisotropic systems by picosecond acoustics

(2011) Shuo Zhang et al.   JOURNAL OF APPLIED PHYSICS

A novel approach for flip chip solder joint inspection based on pulsed phase thermography

(2011) Xiangning Lu et al.   NDT & E INTERNATIONAL

A comparison of the pulsed, lock-in and frequency modulated thermography nondestructive evaluation techniques

(2011) Krishnendu Chatterjee et al.   NDT & E INTERNATIONAL

Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints

(2011) Tian Tian et al.   SCRIPTA MATERIALIA

Ultrasonic Array for Obstacle Detection Based on CDMA with Kasami Codes

(2011) Cristina Diego et al.   SENSORS

Laser Ultrasonic Inspection of Solder Bumps in Flip-Chip Packages Using Virtual Chip Package as Reference

(2011) Charles Ume et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods

(2010) Jin Yang et al.   IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL

Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy

(2010) S. Brand et al.   MICROELECTRONICS RELIABILITY

Reliability challenges in 3D IC packaging technology

(2010) K.N. Tu   MICROELECTRONICS RELIABILITY

Defect Detection of Flip Chip Solder Bumps With Wavelet Analysis of Laser Ultrasound Signals

(2009) Jin Yang et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Study of Flip Chip Solder Joint Cracks Under Temperature Cycling Using a Laser Ultrasound Inspection System

(2009) Lizheng Zhang et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

(2009) Jin Yang et al.   JOURNAL OF ELECTRONIC PACKAGING

Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package

(2009) F. Infante et al.   MICROELECTRONICS RELIABILITY

3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

(2009) Jian-Qiang Lu   PROCEEDINGS OF THE IEEE

Temperature measurement and heat flux characterization in grinding using thermography

(2008) A. Brosse et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

A quantitative review of three flash thermography processing routines

(2007) Mohammed A. Omar et al.   INFRARED PHYSICS & TECHNOLOGY

Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography

(2007) Manyong Choi et al.   NDT & E INTERNATIONAL