Using BP network for ultrasonic inspection of flip chip solder joints

Published 2012 View Full Article

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Title
Using BP network for ultrasonic inspection of flip chip solder joints
Authors
Keywords
-
Journal
MECHANICAL SYSTEMS AND SIGNAL PROCESSING
Volume 34, Issue 1-2, Pages 183-190
Publisher
Elsevier BV
Online
2012-09-05
DOI
10.1016/j.ymssp.2012.08.005

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