Thickness effect on the generation of temperature and curing degree gradients in epoxy–amine thermoset systems

FE simulation of the curing behavior of the epoxy adhesive Hysol EA-9321

(2015) O. Devaux et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Alignments and network of graphite fillers to improve thermal conductivity of epoxy-based composites

(2015) N. Burger et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Thermal conductivity enhancement with different fillers for epoxy resin adhesives

(2014) Yuan-Xiang Fu et al.   APPLIED THERMAL ENGINEERING

Cure kinetics characterization and monitoring of an epoxy resin using DSC, Raman spectroscopy, and DEA

(2013) Ricky Hardis et al.   COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

Fabrication, process simulation and testing of a thick CFRP component using the RTM process

(2013) E. Poodts et al.   COMPOSITES PART B-ENGINEERING

A comparative study of epoxy resin cured with a linear diamine and a branched polyamine

(2012) Jintao Wan et al.   CHEMICAL ENGINEERING JOURNAL

A cure kinetics, diffusion controlled and temperature dependent, identification of the Araldite LY556 epoxy

(2010) N. Rabearison et al.   JOURNAL OF MATERIALS SCIENCE

A FEM coupling model for properties prediction during the curing of an epoxy matrix

(2009) N. Rabearison et al.   COMPUTATIONAL MATERIALS SCIENCE

Effect of cure cycle on curing process and hardness for epoxy resin

(2009) J. Zhang et al.   Express Polymer Letters