Thermal conductivity enhancement with different fillers for epoxy resin adhesives

Published 2014 View Full Article

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Title
Thermal conductivity enhancement with different fillers for epoxy resin adhesives
Authors
Keywords
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Journal
APPLIED THERMAL ENGINEERING
Volume 66, Issue 1-2, Pages 493-498
Publisher
Elsevier BV
Online
2014-02-28
DOI
10.1016/j.applthermaleng.2014.02.044

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