A full-field crystal plasticity study on how texture and grain structure influences hydrostatic stress in thermally strained β-Sn films

Effect of Substrate Composition on Whisker Growth in Sn Coatings

(2018) Piyush Jagtap et al.   JOURNAL OF ELECTRONIC MATERIALS

Fourier-based spectral method solution to finite strain crystal plasticity with free surfaces

(2018) Tias Maiti et al.   SCRIPTA MATERIALIA

Subsurface Grain Morphology Reconstruction by Differential Aperture X-ray Microscopy

(2017) Philip Eisenlohr et al.   JOM

Elasto-viscoplastic phase field modelling of anisotropic cleavage fracture

(2017) P. Shanthraj et al.   JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS

In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation

(2016) Fei Pei et al.   JOURNAL OF APPLIED PHYSICS

The crystallographic growth directions of Sn whiskers

(2015) J. Stein et al.   ACTA MATERIALIA

Numerically robust spectral methods for crystal plasticity simulations of heterogeneous materials

(2015) P. Shanthraj et al.   INTERNATIONAL JOURNAL OF PLASTICITY

Electron beam induced growth of tin whiskers

(2015) A. C. Vasko et al.   JOURNAL OF APPLIED PHYSICS

Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films

(2015) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates

(2015) A. He et al.   JOURNAL OF MATERIALS SCIENCE

Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates

(2014) J. Stein et al.   JOURNAL OF ELECTRONIC MATERIALS

Electrostatic Theory of Metal Whiskers

(2014) V. G. Karpov   Physical Review Applied

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

(2013) P. Sarobol et al.   ACTA MATERIALIA

Evolution of tin whiskers and subsiding grains in thermal cycling

(2013) Ying Wang et al.   JOURNAL OF MATERIALS SCIENCE

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms

(2013) Eric Chason et al.   PROGRESS IN SURFACE SCIENCE

A spectral method solution to crystal elasto-viscoplasticity at finite strains

(2012) P. Eisenlohr et al.   INTERNATIONAL JOURNAL OF PLASTICITY

Crystallographic Characterization of an Electroplated Zinc Coating Prone to Whiskers

(2012) Auriane Etienne et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Whisker Formation Concepts—The End Game

(2011) George Galyon   IEEE Transactions on Components Packaging and Manufacturing Technology

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound

(2009) Eric Buchovecky et al.   JOURNAL OF ELECTRONIC MATERIALS

Indentation-induced tin whiskers on electroplated tin coatings

(2008) Fuqian Yang et al.   JOURNAL OF APPLIED PHYSICS

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

(2008) Yoshikuni Nakadaira et al.   MICROELECTRONICS RELIABILITY