Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

(2013) P. Sarobol et al.   ACTA MATERIALIA

Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films

(2013) P. Sarobol et al.   MATERIALS LETTERS

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms

(2013) Eric Chason et al.   PROGRESS IN SURFACE SCIENCE

Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization

(2012) Fei Pei et al.   APPLIED PHYSICS LETTERS

Crystallographic Characterization of Whiskers using EBSD

(2011) J Michael et al.   MICROSCOPY AND MICROANALYSIS

Atomistic simulation of hillock growth

(2010) T. Frolov et al.   ACTA MATERIALIA

An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis

(2010) Jing Cheng et al.   JOURNAL OF MATERIALS SCIENCE

A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion

(2009) Eric J. Buchovecky et al.   APPLIED PHYSICS LETTERS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS