Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method

A Chemical Mechanical Planarization Model Including Global Pressure Distribution and Feature Size Effects

(2016) Ziwei Yang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

(2014) Hyunseop Lee et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

A mixed elastohydrodynamic lubrication model with layered elastic theory for simulation of chemical mechanical polishing

(2013) Ping Zhou et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Material removal mechanism during porous silica cluster impact on crystal silicon substrate studied by molecular dynamics simulation

(2012) Ruling Chen et al.   APPLIED SURFACE SCIENCE

An Analytical Model of Contact Pressure Distribution Caused by 3-D Wafer Topography in Chemical-Mechanical Polishing Processes

(2012) Lixiao Wu   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study

(2010) Lina Si et al.   JOURNAL OF APPLIED PHYSICS

Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

(2009) Xuesong Han et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING