Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding
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Title
Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding
Authors
Keywords
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Journal
Journal of Materials Chemistry C
Volume 5, Issue 48, Pages 12769-12776
Publisher
Royal Society of Chemistry (RSC)
Online
2017-11-23
DOI
10.1039/c7tc03823b
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