Metallic Conductive Nanowires Elaborated by PVD Metal Deposition on Suspended DNA Bundles

Metallic Nanostructures Based on DNA Nanoshapes

(2016) Boxuan Shen et al.   Nanomaterials

Flow-Enabled Self-Assembly of Large-Scale Aligned Nanowires

(2015) Bo Li et al.   ANGEWANDTE CHEMIE-INTERNATIONAL EDITION

Chemical and electrochemical routes to DNA-templated rhodium nanowires

(2015) Hasan Daw A. Mohamed et al.   Journal of Materials Chemistry C

DNA-templated nanowires: morphology and electrical conductivity

(2014) Scott M. D. Watson et al.   Nanoscale

Writing and Functionalisation of Suspended DNA Nanowires on Superhydrophobic Pillar Arrays

(2014) Ermanno Miele et al.   Small

Controlling DNA Bundle Size and Spatial Arrangement in Self-assembled Arrays on Superhydrophobic Surface

(2014) Gabriele Ciasca et al.   Nano-Micro Letters

Advanced Interconnects: Materials, Processing, and Reliability

(2014) Mikhail R. Baklanov et al.   ECS Journal of Solid State Science and Technology

Solution-based DNA-templating of sub-10 nm conductive copper nanowires

(2014) Jonathan Pate et al.   Journal of Materials Chemistry C

Networks of DNA-templated palladium nanowires: structural and electrical characterisation and their use as hydrogen gas sensors

(2013) Mariam N. Al-Hinai et al.   FARADAY DISCUSSIONS

Surface “Click” Reaction of DNA followed by Directed Metalization for the Construction of Contactable Conducting Nanostructures

(2012) Jan Timper et al.   ANGEWANDTE CHEMIE-INTERNATIONAL EDITION

Direct Imaging of DNA Fibers: The Visage of Double Helix

(2012) Francesco Gentile et al.   NANO LETTERS

Lithographically Patterned Nanowire Electrodeposition: A Method for Patterning Electrically Continuous Metal Nanowires on Dielectrics

(2008) Chenxiang Xiang et al.   ACS Nano

Synthesis of Thin and Highly Conductive DNA-Based Palladium Nanowires

(2008) Khoa Nguyen et al.   ADVANCED MATERIALS

Accurate electrical testing of individual gold nanowires by in situ scanning electron microscope nanomanipulators

(2008) Yong Peng et al.   APPLIED PHYSICS LETTERS