Wafer yield prediction using derived spatial variables

Statistical Surface Monitoring by Spatial-Structure Modeling

(2017) Andi Wang et al.   JOURNAL OF QUALITY TECHNOLOGY

A random effect autologistic regression model with application to the characterization of multiple microstructure samples

(2015) Nailong Zhang et al.   IIE TRANSACTIONS

Monitoring wafers’ geometric quality using an additive Gaussian process model

(2015) Linmiao Zhang et al.   IIE TRANSACTIONS

A spatial variable selection method for monitoring product surface

(2015) Kaibo Wang et al.   INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH

A novel defect detection and identification method in optical inspection

(2013) Liangjun Xie et al.   NEURAL COMPUTING & APPLICATIONS

An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing

(2012) Chiao-Wen Liu et al.   ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE

Defect cluster recognition system for fabricated semiconductor wafers

(2012) Melanie Po-Leen Ooi et al.   ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE

The solution path of the generalized lasso

(2011) Ryan J. Tibshirani et al.   ANNALS OF STATISTICS

Yield Prediction for Integrated Circuits Manufacturing Through Hierarchical Bayesian Modeling of Spatial Defects

(2011) Tao Yuan et al.   IEEE TRANSACTIONS ON RELIABILITY

A Path Algorithm for the Fused Lasso Signal Approximator

(2011) Holger Hoefling   JOURNAL OF COMPUTATIONAL AND GRAPHICAL STATISTICS

Semiconductor Manufacturing Process Monitoring Based on Adaptive Substatistical PCA

(2010) Zhiqiang Ge et al.   IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Fuzzy neural network based yield prediction model for semiconductor manufacturing system

(2009) Lihui Wu et al.   INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH

Automatic Identification of Defect Patterns in Semiconductor Wafer Maps Using Spatial Correlogram and Dynamic Time Warping

(2008) Young-Seon Jeong et al.   IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

A dual burn-in policy for defect-tolerant memory products using the number of repairs as a quality indicator

(2008) Seung-Hoon Tong et al.   MICROELECTRONICS RELIABILITY

Spatial defect pattern recognition on semiconductor wafers using model-based clustering and Bayesian inference

(2007) Tao Yuan et al.   EUROPEAN JOURNAL OF OPERATIONAL RESEARCH