Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling

Published 2017 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling
Authors
Keywords
Transient electronic cooling, Heat pipe, Nanoparticles, Composite heat sink
Journal
MICROELECTRONICS RELIABILITY
Volume 73, Issue -, Pages 1-13
Publisher
Elsevier BV
Online
2017-04-13
DOI
10.1016/j.microrel.2017.04.006

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.