Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling

出版年份 2017 全文链接

标题

作者

关键词

Transient electronic cooling, Heat pipe, Nanoparticles, Composite heat sink

出版物

Volume 73, Issue -, Pages 1-13

出版商

Elsevier BV

发表日期

2017-04-13

DOI

10.1016/j.microrel.2017.04.006

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