Channel temperature measurement in hermetic packaged GaN HEMTs power switch using fast static and transient thermal methods

Title
Channel temperature measurement in hermetic packaged GaN HEMTs power switch using fast static and transient thermal methods
Authors
Keywords
Junction temperature, Power semiconductor device, Heating curve, Cooling curve, Transient thermal impedance (TTI), Safe operating area (SOA)
Journal
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
Volume 129, Issue 2, Pages 1159-1168
Publisher
Springer Nature
Online
2017-03-15
DOI
10.1007/s10973-017-6275-7

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